Materials Science Conference

7 years ago Posted By : User Ref No: WURUR23971 0
  • Image
  • TypeConference
  • Image
  • Location Osaka, Tohoku, Japan
  • Price
  • Date 18-03-2019 - 19-03-2019
Materials Science Conference, Osaka, Tohoku, Japan
Conference Title
Materials Science Conference
Event Type
Conference
Conference Date
18-03-2019 to 19-03-2019
Last Date for Applying
30-11-2018
Location
Osaka, Tohoku, Japan
Organization Name / Organize By
Materials Science Conference
Organizing/Related Departments
Conference
Organization Type
Event Organizing Company
ConferenceCategory
Technical
ConferenceLevel
International
Related Industries

Engineering

Electrical/Electronics

Mechanical

Biotechnology

Location
Osaka, Tohoku, Japan

We cordially invite you to participate in the Materials Science Conference, which will take place at Osaka, Japan during March 18-19, 2018. We shall be pleased to welcome you there!

The field of materials science has changed rapidly in the last decades and new methods help scientists all over the world to master the challenges of the 21st century. Socioeconomic changes cause also changes in materials research. This Materials Science Conference is providing a platform to scientists to communicate regarding the investigaton on the structure and properties of all engineering materials. This will also provide an international platform to companies and institutions to present their services, products, innovations and research results. Materials Science 2019 focuses on research and application of advanced materials via interdisciplinary exchanges among materials scientists and engineers.

This event focuses on various aspects of material science research such as electronic, electrochemical, ionic, magnetic, optical, and biosensing properties of solid state materials in bulk, thin film and particulate forms along with the synthesis, processing, characterization, structure, physical properties and computational aspects of nano-crystalline, crystalline, amorphous and glassy forms of ceramics, semiconductors, layered insertion compounds, low-dimensional compounds and systems, fast-ion conductors, polymers and dielectrics.

Why to attend???

Materials Science Conference is the biggest conference dedicated to Materials Science and Engineering professionals providing a premier technical forum for reporting and learning about the latest new generation technologies developed during the course of time along with discussing their applications. Events include hot topics presentations from all over the world and professional networking with industries, leading working groups and panels.

Meet your objective business sector with individuals from and around the globe concentrated on finding out about Materials science and Engineering, this is the best chance to achieve the biggest collection of members from everywhere throughout the World. Conduct shows, disperse data, meet with current, make a sprinkle with another product offering, and get name acknowledgment at this occasion. Widely acclaimed speakers, the latest methods, strategies, and the most up to date overhauls in Polymer science and Engineering are signs of this meeting.

Target Audience:                                                                                                  

  • Scientists
  • Professors
  • Research Scholars and students
  • Nanotechnology Companies
  • Nanotechnology Associations
  • Advanced Materials and Nanotechnology Engineers
  • Materials Scientists/Research Professors
  • Physicists/Chemists
  • Junior/Senior research fellows of Materials Science/ Nanotechnology/ Polymer Science
  • Biotechnology/ Biomaterials professionals
  • Materials Science Students
  • Directors of chemical companies
  • Materials Engineers
  • Members of different materials science associations
  • Polymer companies

 We invite you to join us at Osaka, Japan  to attend the world class materials science event!!!!!

For detailed sessions, please visit: http://www.meetingsint.com/conferences/materialscience

Submit your abstract online at: http://www.meetingsint.com/conferences/materialscience/abstract-submission

Register online: http://www.meetingsint.com/conferences/materialscience/registration

Registration Fees
Available
Registration Fees Details
Registration fee: $499
Registration Ways
Website
Address/Venue
  Hyatt Regency Osaka 1-13-11 Nanko-Kita, Suminoe-Ku  Pin/Zip Code : 559-0034
Landmark
Osaka
Official Email ID
Contact
Eva Tamplin

[email protected]

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