7th International Conference on Key Engineering Materials (ICKEM 2017)

Welcome to ICKEM!

The 7th International Conference on Key Engineering Materials will take place in Penang, Malaysia on March 11-13, 2017.

The idea of the conference is providing a platform for scientists, scholars, and engineers from all over the world to present ongoing researches , and to foster research relations between the Universities and the Industry. We are looking forward to your participation.

CALL FOR PAPERS:

The purpose of the The 7th International Conference on Key Engineering Materials (ICKEM2017) is to bring together researchers, engineers and practitioners interested in the related fields.

Papers describing original work are invited in any of the areas listed below. Acceptance will be based on relevance, contribution and originality. There will be both oral and poster sessions. Each of these topic areas is expanded below but the sub-topics list is not exclusive. Papers may address one or more of the listed sub-topics, although authors should not feel limited by them.

It features invited keynote speakers as well as peer-reviewed paper presentations.The conference is completely open (one needs to register first), you will not have to be an author or a discussant to attend.

• Biomaterials in Different Applications
• Novel Composite Materials in Vivid Applications
• Application of Novel Materials in Civil Engineering
• Advances in Materials and Manufacturing Technology
• Materials and Technologies in Environmental Engineering
• Studies on Corrosion, Coating, and Aspects of Chemical Engineering
• Electrical, Electronic, and Optoelectronic Materials: Synthesis and Applications
• Trends in the Development of Nanomaterials, Nanocomposites and Nanotechnology

PUBLICATION:
The conference proceedings of ICKEM2017 will be published in IOP Conference Series: Materials Science and Engineering (Online ISSN: 1757-899X; Print ISSN: 1757-8981)
Indexing: Conference Proceedings Citation Index – Science (CPCI-S) (Thomson Reuters, Web of Science), Ei Compendex, Scopus, Inspec, etc.

SUBMISSION METHODS:

• Please log in the EasyChair Submission System and upload your paper.
• Should you have any questions about the submission, please contact us at: [email protected]

Others Details

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