2024 9th International Conference on Mechanical Structures and Smart Materials

3 months ago Posted By : User Ref No: WURUR176339 0
  • Image
  • TypeConference
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  • Location Mercure Beijing Downtown, Beijing, China
  • Price
  • Date 15-06-2024 - 16-06-2024
Conference Title
2024 9th International Conference on Mechanical Structures and Smart Materials
Event Type
Conference
Conference Date
15-06-2024 to 16-06-2024
Location
Mercure Beijing Downtown, Beijing, China
Organization Name / Organize By
Spectrum Academy
Organizing/Related Departments
Spectrum Academy
Organization Type
Academy
ConferenceCategory
Technical
ConferenceLevel
International
Related Industries

Engineering

Mechanical

Location
Mercure Beijing Downtown, Beijing, China

Session Description
ICMSSM 2024 is the 9th edition in this series of conferences started in 2013 that are devoted to around the design and analysis of mechanical structures that incorporate smart materials. ICMSSM is a famous event worldwide that covers many dimensions of adaptive structural design, smart materials for intelligent sensing and monitoring systems, energy harvesting and storage, vibration control and damping, biomechanics.

Following the traditions of previous successful ICMSSM conferences held in Xiamen, China in 2013; Kuala Lumpur, Malaysia in 2014; Nanjing, China in 2016; Shenzhen, China in 2018; Xi'an, China in 2019; Ho Chi Minh City, Vietnam in 2020; Changsha, China in 2021; and most recently, a virtual gathering in Bangkok in 2023.

The paper publication

ICMSSM 2024 will produce electronic formal proceedings - with ISBN number, and to be indexed in the major bibliographical search engines. The ICMSSM formal proceedings will include: regular papers accepted as oral presentation, regular papers accepted as posters, papers for special sessions and workshops.

All accepted full papers will be published in IOP Conference Series: Journal of Physics (JPCS) and submitted for major indexing service like EI-Compendex, SCOPUS and etc.

Conference Theme

Topics of Interest for submission include, but are not limited to:

T1: Mechanical Science and Technology Advances

T2: Smart Structures and Systems

T3: Smart Materials and Surfaces

T4: Materials Manufacturing and Processing

T5: Methodology of Research and Analysis and Modeling

Keynote Speakers

Assoc. Prof. Ching Yern Chee, Universiti Malaya, Malaysia

Prof. Sinin bin Hamdan, Universiti Malaysia Sarawak, Malaysia

Prof. Yan Zhuge, UniSA STEM, University of South Australia, Australia

Assoc. Prof. Teik-Cheng Lim, Singapore University of Social Sciences, Singapore

Prof. Daolun Chen, Toronto Metropolitan University, Canada

Prof. Alan Kin Tak, Technological and Higher Education Institute of Hong Kong

Prof. Zhili Dong, Nanyang Technological University, Singapore

Submission method

1、Submit by system: https://icmssm.org/openconf/openconf.php  

2、Email: [email protected]

 Paper submission deadline: June 5, 2024

Registration Fees
Not Mention
Registration Ways
Email
Website
Address/Venue
Beijing  No.16 Jia, Xi Da Wang Road, Chao Yang District, 100124 BEIJING, CHINA 
Contact