- TypeConference
- Location Xiamen, Fujian, China
- Date 28-10-2022 - 30-10-2022
Engineering
2022 International Conference on Optical Technology, Semiconductor Materials and Devices (OTSMD 2022)
CONFERENCE INFORMATION:
Website: http://www.otsmd.org/
Conference Date: 28th to 30th October 2022
Venue: Xiamen, China
Submission Deadline: 24th October 2022
Index: EI, Scopus
Nowadays, the application of optical technology has emerged in various fields. With the development of microelectronics technology in the direction of high density and high reliability, the requirement for semiconductor materials has been increasingly high. To promote the development of optical technology, semiconductor materials and devices, and encourage academic exchanges in these fields, the 2022 International Conference on Optical Technology, Semiconductor Materials and Devices (OTSMD 2022) will be held in Xiamen, China from 28th to 30th October 2022. OTSMD 2022 is an international forum for scientists, engineers, and practitioners to present their latest research and development results in all areas of Intelligent Manufacturing and Industrial Automation. Conference topics mainly include but are not limited to Semiconductor device applications; Diode; Hall effect sensors, etc.
Conference Chair
Prof. Harith Bin Ahmad,University of Malaya, Malaysia
Keynote speaker
Prof. Fujun Zhang, Beijing Jiaotong University, China
Prof. Harith Bin Ahmad,University of Malaya, Malaysia
Prof. Li Pei, Beijing Jiaotong University, China
Invited Speaker
Prof. Navendu Goswami, Jaypee Institute of Information Technology (JIIT), India
3. Call for papers
The conference covers all aspects of technologies, applications, and services. The topics of interest are not limited to:
Semiconductor device applications; Diode; Dislocations in LD and LED semiconductor heterostructures; Hall effect sensor (magnetic field sensor); Infrared, green, and blue-violet pulsed lasers based on semiconductor structures; Integrated mode locked laser systems in semiconductor photonic integrated circuits; MEMS manufacturing and technology; Mobility in parallel transport; New and advanced metrology solutions; Nonlinear problems in quantum semiconductor modeling; Novel approach for transverse mode engineering in edge-emitting semiconductor lasers; Optical properties of thin heterostructures; Perpendicular transport; Photo coupler (Optocoupler); Photocell; Quantum semiconductor
Artificial Vision; Atmospheric and Environmental Optics; Biomedical Photonics; Bio-photonics; CD storage technology; Computational Optical Sensing and Imaging; Crystal optics and metamaterials; Development of Optoelectronic Technology Application; Electromagnetic wave; Fiber optics; Geometric optics; Image and signal processing; Integrated Optics; Integrated optics; Laser application; Laser biology; Laser interaction with matter; Laser methods in chemistry, biology, and medicine; Machine vision; Micro-nano Optoelectronic Mechanical System; Nano Optoelectronics; Nanomaterials
Non-imaging opticsï¼Nonlinear optics
Optical calculation; Optical communication; Optical interconnect technology; Optical sensor; Optical vortex; Optoelectronic; Photometry
photonic crystal; Photonics and nanophotonics; Photophysics; Photorefractive Effects, Materials, and Devices; Quantum optics; Quantum optics andquantum information; Semiconductor devices and circuits; Semiconductor lasers; Semiconductor lighting; Semiconductor purity and interfaces; Silicon-controlled rectifier; Single quantum; Solar light and applications; Spectroscopy, Imaging and Metrology; Statistical optics; Synchrotron light source; Terahertz technology; Thin film optics; Thyristor; transistor; Ultrafast optics; Wave optics
5. Participation Types:
Package A: Only Attendance
Package B: Abstract Submission + Oral Presentation
Package C: Abstract Submission + Poster Presentation
Package D: Full Paper Publication + Oral/Poster Presentation + Attendance
Note: If you need paper publication and presentation both, please submit full paper.
If you need to make presentation without publication, please submit abstract only.
Submission Methods:
If you choose Package D, please submit the full paper (word + pdf) to SUBMISSION SYSTEM
If you choose Package A, B or C, please register via REGISTRATION SYSTEM .
7.Publication
8.CONTACT US
Conference Secretary: Leah Li
E-mail: [email protected]
Tel: +86-17737319063 (WeChat)
QQ: 978640953