2019 Spring International Conference on Engineering Mathematics and Physics(EMP-S 2019)

6 years ago Posted By : User Ref No: WURUR24461 0
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  • TypeConference
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  • Location Xiamen, Fujian, China
  • Price
  • Date 22-04-2019 - 24-04-2019
2019 Spring International Conference on Engineering Mathematics and Physics(EMP-S 2019), Xiamen, Fujian, China
Conference Title
2019 Spring International Conference on Engineering Mathematics and Physics(EMP-S 2019)
Event Type
Conference
Conference Date
22-04-2019 to 24-04-2019
Location
Xiamen, Fujian, China
Organization Name / Organize By
Rolin
Organizing/Related Departments
Engineering Information Institute
Organization Type
Event Management Company
ConferenceCategory
Technical
ConferenceLevel
International
Related Industries

Engineering

Location
Xiamen, Fujian, China

2019 Spring International Conference on Engineering Mathematics and Physics (EMP-S)

Conference Date: April 22-24, 2019
Conference Venue: Xiamen, China
Website: http://www.engii.org/conference/SCET2019/EMP.htm
Online Registration System: http://www.engii.org/RegistrationSubmission/default.aspx?ConferenceID=1093 

Invited Speakers

Prof. Wanyang Dai, Nanjing University, China
Prof. Manu Pratap Singh, Dr. B. R. Ambedkar University, India
Prof. Sanjeev KUMAR, Dr. B.R. Ambedkar University, India
Prof. Lee D. Wilson, University of Saskatchewan, Canada
Prof. Laichang Zhang, Edith Cowan University, Australia
If you wish to serve the conference as an Invited Speaker, please send email to us with your CV.

Publication and Presentation

All the accepted papers in English will be published by World Journal of Engineering and Technology (ISSN Online: 2331-4249), a peer-reviewed open access journal that can ensure the widest dissemination of your published work.

Contact Us

Contact Person: Ms Rolin
Email: [email protected] ([email protected])
Tel : +86 151 7233 0844
QQ: 741494290/3025797047
Linkedin: SCET Conference
Wechat(微信): Engii_vivian

Conference Topics

Topics: The conference is soliciting state-of-the-art research papers in the following areas of interest: 
Advanced Numerical Algorithms
Advanced topics in engineering physics
Algorithmic Approaches to Computational Kernels and Applications
Algorithms and model validation
Application of Soft Computing, Knowledge Engineering, and Machine Learning
Applications of Computation as a Scientific Paradigm
Automation, Control and Robotics
Aviation and Space Technology
Beam and plate deformations
Bioengineering and Bioinformatics
Biomedical Physics and Engineering
biophysics and medical physics
Boundary Element Methods
Circuits, Networks and Systems
Complex Systems: Modeling and Simulation
Computation in Complex Networks
Computational Mathematics
Computational Mechanics, Economics, Finance and Statistics
Computational Physics, Chemistry, Biology and Medicine
Computational Science and Engineering
Computational Statistics
Computational tools for engineering physics
Control of Dynamical Systems
Dynamical Systems
Electronics, Microelectronics and Nanoelectronics
Engineering Mathematics
Engineering physics and analysis
Engineering physics and applications
Engineering research and scientific methods
Heat transfer and neutron diffusion
High Performance Computing
Hybrid Computational Methods
Industrial Mathematics
Instrumentation and Measurement
Materials Science
Mathematical Methods in Sciences and Engineering
Mathematical Modeling
Mathematical models for the information society
Mathematical models in Economy and Insurance
Mathematical models in Medicine
Mechanics and Fluid Mechanics
Meshless Methods
Micro- and nanoscale mechanics
Multimedia and Video Systems
Nonlinear Analysis
Numerical Techniques
Optimization Inverse Problems
Orbital mechanics and structural vibrations
Parallel Numerical Algorithms
Programming for engineering physics
Quantum information science
Semiconductors and materials development
Vacuum technology

Registration Fees
Available
Registration Fees Details
Registration Fee Package A: Regular Attendance (No Submission Required) USD 400 (RMB 2400) Package B: Regular Attendance+Abstract+Presentation USD 450 (RMB 2700) Package C: Regular Attendance+Paper Publication+Presentation USD 600 (RMB 3600) The Regular Attendance Fee Includes 1. Access to all technical sessions 2. Lunch on April 23 and 24, dinner on April 23. 3. Coffee breaks during all sessions 4. One hard copy of the conference guide and journal
Registration Ways
Email
Phone
Website
Other
Address/Venue
  Not-final 
Official Email ID
Contact
Ms. Rolin

[email protected]

   +86 15172330844