International Conference on Research & Innovation in Computer, Electronics and Manufacturing Engineering (RICEME-17)

he idea of International Conference on Research & Innovation in Computer, Electronics and Manufacturing Engineering (RICEME-17) scheduled on Feb. 2-3, 2017 at Bali (Indonesia) is for the researchers, scientists, scholars, engineers and parctitioners from all around the world to present and share ongoing research activities. This conference provides opportunities for the delegates to exchange new ideas and application experiences face to face, to establish business or research relations and to find global partners for future collaboration.

All full paper submissions will be peer reviewed and evaluated based on originality, technical and/or research content/depth, correctness, relevance to conference, contributions, and readability. One Best Presenation Award from each session will also be distributed at the time of the conference.

All accepted papers of RICEME-17 will be published in the printed conference proceedings with valid International ISBN number. Each Paper will be assigned unique Digital Object Identifier (DOI) from CROSSREF and the Proceedings of the Conference will be archived in EARAI's Engineering & Technology Digital Library. The Proceeding will be also submitted to SCOPUS/ISI Thomson for review. In addition the proceedings will be indexed at all major search engines.

English is the official language of the conference. We welcome paper submissions. Prospective authors are invited to submit full (and original research) papers (which is NOT submitted or published or under consideration anywhere in other conferences/journal) in electronic (DOC or PDF) format alongwith the contact information.
SUBMISSION METHODS
1. Email: [email protected]
OR
2. Electronic Submission System ( .doc/.docx/.pdf formats)
Prospective authors are kindly invited to submit full text papers including results, tables, figures and references. Full text papers (.docx, .doc, .pdf) will be accepted by Electronic Submission System. Any question, please contact: [email protected]
CALL FOR PAPERS
Topics of interest for submission include any topics on Engineering and Technology (RICEME-17)

• Artificial Intelligence and Pattern Recognition
• Aeronautical and Aviation Engineering
• Automation, Mechatronics and Robotics
• Computer Science & Engineering
• Electrical Engineering
• Information Technology
• Electronics Engineering
• Image Processing and Recognition
• Instrumentation Engineering
• Data Mining
• Bio-Medical Engineering
• Software Enguneering
• Nano-Technology
• Manufacturing Engineering
• and its Applications

IMPORTANT DATES
Deadline of NEW Full Paper/Abstract/Poster submission
Round-1 Oct. 20, 2016
Round-2 Nov.13, 2016
Round-3 Dec.05, 2016
Notification of acceptance
Round-1 Oct. 28, 2016
Round-2 Nov. 20, 2016
Round-3 Dec.12, 2016
Deadline for Camera ready and authors' registration
Round-1 Nov. 05, 2016
Round-2 Nov. 27, 2016
Round-3 Dec.18, 2016
Conference Dates
Feb. 2-3, 2017

Others Details

All full paper submissions will be peer reviewed and evaluated based on originality, technical and/or research content/depth, correctness, relevance to conference, contributions, and readability. One Best Presenation Award from each session will also be distributed at the time of the conference. For more details and updates please visit website