The 8th IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA 2025)

The 8th IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA 2025)
Time: Oct 22-24, 2025
Venue: Macao, China
Official Website: https://www.ieee-icta.cn

【About Conference】
The 8th IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA 2025), will be held on October 22-24, 2025 in Macao, China. This year's theme is "Analog, AI and Applications".

The conference will feature both invited and contributed papers. Distinguished researchers will be invited to deliver keynote speeches on technology or circuit trends and significant advances. The best contributed papers will be selected for awards. All papers will be presented in parallel sessions, including invited talks and focused sessions. ICTA will start with FREE Distinguished Lectures and concluded with forums/workshops. Exhibition showcasing the latest engineering samples, tools and technology options will be facilitated as well. 

【Sponsored by】
IEEE
MTT-S Nanjing
BIE

【Patrons】
EDS Beijing Chapter
SSCS Guangzhou Chapter 
CAS

【Supported by】
CHINA ASSOCIATION FOR SCIENCE AND TECHNOLOGY
University of Macau

【Conference Committee】
- Honorary Chair -
Rui Martins, U. Macau, China

- General Co-Chairs -
Pui-In Mak, U. Macau, China
Sai-Weng Sin, U. Macau, China

- TPC Co-Chairs -
Bo Zhao, ZJU, China
Yan Lu, Tsinghua, China

- Steering Committee Members -
Lin Cheng (Chair), USTC, China
Xiaoyan Gui, XJTU, China
Zhiyi Yu , Sun Yat-sen U., China
Dixian Zhao, Southeast U., China
Liyuan Liu, IS-CAS, China
Fujiang Lin, USTC, China
Zhihua Wang, Tsinghua, China
Nanjian Wu, IS-CAS, China 

- International Advisors -
Jan Van der Spiegel, IEEE SSCS, USA 
Ke Wu, IEEE MTT-S, Canada
Yong Lian, IEEE CASS, USA
Geok Ing Ng, IEEE EDS, Singapore
Giovanni Demicheli, EPFL, Switzerland
Yann Deval, U. Bordeaux, France
R. Bogdan Staszewski, UCD, Ireland
Boon S. Ooi, KAUST, Saudi Arabia 
Hoi-Jun Yoo, KAIST, Korea
Makoto Ikeda, U. of Tokyo. Japan
Patrick Yue, HKUST, China

- Local Arrangement Chair -
Chi-Hang Chan, U. Macau, China

- Tutorial Chair -
Yang Jiang, U. Macau, China

- Keynote Speakers Chair -
Mo Huang, U. Macau, China

- Industry Papers Chair -
Jiawei Xu, U. Macau, China

- Publication Chair -
Haijun Shao, U. Macau, China

- Sponsorship/Exhibition Chair -
Mingqiang Guo, U. Macau, China

- Awards Committee Chair -
Zheng Wang, UESTC, China

- Website Chair -
Ying Zhang, BJAST, China

【Call for Papers】
1.RF Circuits and Wireless Systems: Si-based RFIC building-block circuit, compound-semiconductor-based MMIC building-block circuit, LNA, PA, VCO, PLL, phase shifter, mixer, RF switch, balun, driver amplifier, transceiver, etc.
2.Analog and Mixed-Signal ICs: analog circuits including amplifiers, comparators, oscillators, filters, references, nonlinear analog circuits and digitally-assisted analog circuits; data converters including Nyquist-rate and oversampling ADC and DAC, etc.
3.Power-management ICs: Power management and control circuits; switched-mode power converter ICs using inductive, capacitive, and hybrid techniques; linear regulators; gate drivers; topologies for wide-bandgap devices; power and signal isolators; LED drivers, wireless power, and envelope supply modulators; energy harvesting circuits and systems.
4.Digital ICs and Memory: SoC, processor, FPGA, AI and deep-learning processor, DSP, NoC, memory, etc.
5.Wireline ICs: high-speed data link, optical transceiver, OEIC, SerDes, TIA, CDRs, equalizer, modulator, etc.
6.Modeling, EDA and Testing: compact models and extraction techniques (silicon based), SPICE models and extraction techniques (non-silicon), modeling technique of GaN, SiC, ASM-HEMT, 2D-material-based devices, quantum devices, test structures design and model parameter extraction, RF calibration and reliable data acquisition, EDA, EM/TCAD simulation, co-simulation and verification technique, PDK validation, etc.
7.Device and Process Technologies: CMOS, FinFET, FD-SOI, BCD, SiGe, III-V, HEMT, HBT, 3rd generation materials, GaN, power electronics, SiC, GaO, junctionless device, negative capacitance device, MEMS, device characterization, device FAR, 3D integration, Chiplet, flash, OPT, MPT, SRAM, DRAM, 3D NAND, MRAM, RRAM, PCRAM, FeRAM, crossbar, DRAM+MCU, etc.
8.Packaging and Hybrid Integration: Chiplet, active antenna, EM field, filters, Hybrid MIC, MCM, SiP, SoP, TSV, flip chip assembly, wire bonding, anisotropic conductive film, interconnection technologies, multi-physics and multiscale EM computation/simulation, 3D integration, etc.
9.Sensors and Applications: MEMS sensors, image sensors, physical sensors, chemical sensors, bio-sensors, smart and intelligent sensors, sensor interface, sensor technology and applications, etc
10.System and Applications: IC based module and system integration, automotive electronics, automotive radar, 5G systems, AI systems, IoTs, healthcare and biomedical systems, etc.
11.Emerging Technologies and Applications: heterogeneous integration, III-V compounds, silicon photonics, optoelectronic device, 2D materials, green and implantable materials, neuromorphic device, device characterization, etc.
12.Intelligent Robots: robot kinematics/dynamics/control, system integration, AI in robotics, sensor/actuator, bio-inspired systems, robot perception, human robot interaction, and robot vision, etc.

【Paper submission and deadlines】
To encourage timely reporting of the latest results and to have better opportunities to expand papers for possible journal publications, prospective authors are invited to submit a 2-page paper (both initial submission and final version, if accepted) in English and in IEEE Xplore PDF format. The paper should emphasize original contributions and key findings, including figures, diagrams and results from verified simulations with direct or indirect measurements. Up to 2 additional pages of figures supporting initial submission which will not in final publication are encouraged. References should be clearly cited and up-to-date. Invited papers can extend up to 6 pages submission. By submitting the paper, the authors promise that, if accepted, at least one of them will attend ICTA 2025 with full registration.  

Submission Link: https://epapers2.org/icta2025

【Contact us】
Conference Secretary: Haikie Liao
Contact email: [email protected]
Contact phone: +86-87555888 | 13739469027

Conference Secretariat:
Fanfang Zeng, BIE, China
Qing Wu, BIE, China
Email: [email protected]