4th INTERNATIONAL CONFERENCE ON SUSTAINABLE TECHNOLOGIES FOR INDUSTRY 4.0

ABOUT THE EVENT

WHY STI?
● First conference in southeast Asia on Sustainable Technologies for Industry 4.0
● Only conference in Bangladesh, which is technically sponsored by the central IEEE Computer Society
● All the papers of our previous editions are included in the IEEE xplore digital library within short period of times
● From the very first edition, all the accepted papers are included in the Scopus and other renowned databases
● With each subsequent edition, involvement of international participants is increasing, e.g., 2019: 20 countries, 2020: 22 countries, and 2021: 35 countries
● In our last edition (STI 2021), SEVEN (7) IEEE fellows have joined us as keynote speakers, and it is a common practice

CALL for Paper
STI conference provides a platform for facilitating and promoting innovative research on Industry 4.0 (or Industrial Revolution 4.0) by encompassing research areas related to smart industries, smart grids, intelligent transportation, real-time healthcare, and others that are bolstered by automation and cyber-physical systems. In addition, detailed studies and research are required to design and develop sustainable solutions for Industry 4.0 since they depend on the complex relations among humans, systems and objects, which is also covered in this conference.
STI 2022 welcomes researchers, industry professionals, and practitioners to display their scientific achievements and sustainable solutions for industrial developments in the fields of computer science & engineering, electrical & electronic engineering, textile engineering, robotics and cyber-physical systems related to Industry 4.0. It will be hosted at the permanent campus of Green University of Bangladesh, Purbachal American City, Dhaka, Bangladesh during 17-18 December 2022.
We are seeking original high-quality innovative research for submissions. All submissions to STI 2022 will go through a double-blind peer reviewing process. ACcepted and presented papers will be submitted to the IEEE Xplore digital library.