3rd International Conference on Research & Innovation in Computer, Electronics and Manufacturing Engineering (RICEME-17)

The idea of 3rd International Conference on Research & Innovation in Computer, Electronics and Manufacturing Engineering (RICEME-17) under 5th International Conference on “Advances in Engineering and Technology” scheduled on March 27-28, 2017 Singapore is for the researchers, scientists, scholars, engineers and parctitioners from all around the world to present and share ongoing research activities. This conference provides opportunities for the delegates to exchange new ideas and application experiences face to face, to establish business or research relations and to find global partners for future collaboration.

 

RICEME-17 is sponsored by Excellence in Research & Innovation (EARAI).

All full paper submissions will be peer reviewed and evaluated based on originality, technical and/or research content/depth, correctness, relevance to conference, contributions, and readability. One Best Presenation Award from each session will also be distributed at the time of the conference.

 

All accepted papers of RICEME-17 will be published in the printed conference proceedings with valid International ISBN number. Each Paper will be assigned unique Digital Object Identifier (DOI) from CROSSREF and the Proceedings of the Conference will be archived in EARAI's Engineering & Technology Digital Library. The Proceeding will be also submitted to SCOPUS/ISI Thomson for review. In addition the proceedings will be indexed at all major search engines.

 

English is the official language of the conference. We welcome paper submissions. Prospective authors are invited to submit full (and original research) papers (which is NOT submitted or published or under consideration anywhere in other conferences/journal) in electronic (DOC or PDF) format alongwith the contact information.

CALL FOR PAPERS:
Topics of interest for submission include any topics on Engineering and Technology (RICEME-17)

• Artificial Intelligence and Pattern Recognition
• Aeronautical and Aviation Engineering
• Automation, Mechatronics and Robotics
• Computer Science & Engineering
• Electrical Engineering
• Information Technology
• Electronics Engineering 
• Image Processing and Recognition
• Instrumentation Engineering
• Data Mining
• Bio-Medical Engineering
• Software Enguneering
• Nano-Technology
• Manufacturing Engineering
• and its Applications

SUBMISSION METHODS:

1. Email: [email protected]
OR
2. Electronic Submission System ( .doc/.docx/.pdf formats)

IMPORTANT DATES:
Deadline of NEW Full Paper/Abstract/Poster submission:
Round1: Dec.10, 2016
Round2: Jan. 03, 2017
Round3: Feb. 03, 2017
Notification of acceptance:
Round1: Dec. 20, 2016  
Round2: Jan. 12, 2017  
Round3: Feb. 09, 2017
Deadline for Camera ready and authors' registration:
Round1: Dec. 30, 2016  
Round2: Jan. 25, 2017  
Round3: Feb. 20, 2017
Conference Dates:

March 27-28, 2017

Others Details

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