2024 The 9th International Conference on Integrated Circuits and Microsystems (ICICM 2024)

★Co-Sponsored by: 
==Southeast University, China 
==University of Electronic Science and Technology of China, China 
==Wuhan University of Technology, China

==Submission==
1. Full paper (publication and presentation) 
2. Abstract (presentation only) 
**Electronic submission system: https://easychair.org/conferences/?conf=icicm2024
**Email submission:  [email protected] 
More detail about submission, please visit at http://icicm.net/submission.html

=Publication=
The accepted and registered papers will be publication in Conference Proceedings, which will be indexed by EI Compendex, Scopus, etc.
***ICICM2016-2023 has been successfully indexed by EI Compendex and Scopus already!

=Topics (include but not limit)=
â–º Devices and Circuits for Wirless System
â–º Application Specific Circuits and Systems for Communication
â–º Digital, Analog, Mixed Signal IC and SOC design technology
â–º Silicon integrated circuits and manufacturing
â–º Low-power, RF devices & circuits
â–º IC Computer-Aided –Design technology, DFM
â–º Silicon/germanium devices and device physics
â–º Interconnect, Low K, High K and other process technologies
â–º Unconventional and nano-electronics
â–º Organic semiconductor devices and technologies    
â–º Compound semiconductor devices and circuits
â–º Displays, sensors and MEMS    
â–º Semiconductor materials and material characterization
â–º Packaging and testing technology    
â–º Solar cell & other devices for new energy sources
â–º Modeling and simulation    
â–º Equipment technology
â–º Reliability    
â–º Displays, sensors and MEMS
â–º Advance memories technology
For more topics, please visit at: http://icicm.net/call-for-papers.html

==Organizing Committee==
**Advisory Chairs
Pui-in Mak, University of Macau, Macau, China
Ljiljana Trajkovic, Simon Fraser University, Canada

**Conference Chairs
Zhigong Wang, Southeast University, China
Chen Liu, Nanjing University of Posts and Telecommunica