2024 7th International Conference on Materials Design and Applications (ICMDA 2024)

9 months ago Posted By : User Ref No: WURUR154181 0
  • Image
  • TypeConference
  • Image
  • Location Tokyo, Japan
  • Price
  • Date 09-04-2024 - 12-04-2024
2024 7th International Conference on Materials Design and Applications (ICMDA 2024), Tokyo, Japan
Conference Title
2024 7th International Conference on Materials Design and Applications (ICMDA 2024)
Event Type
Conference
Conference Date
09-04-2024 to 12-04-2024
Location
Tokyo, Japan
Organization Name / Organize By
ICMDA 2024
Organizing/Related Departments
International Conference on Materials Design and Applications
Organization Type
Academy
ConferenceCategory
Both (Technical & Non Technical)
ConferenceLevel
International
Related Industries

Engineering

Chemical

Location
Tokyo, Japan

Publication:
  Accepted and registered papers with presentation will be published in below listed journals of Scientific.Net collection.

  Defect and Diffusion Forum (DDF) (ISSN print 1012-0386 / ISSN web 1662-9507)
  Solid State Phenomena (SSP) (ISSN print 1012-0394 / ISSN web 1662-9779)
  Materials Science Forum (MSF) (ISSN print 0255-5476 / ISSN web 1662-9752)
  Key Engineering Materials (KEM) (ISSN print 1013-9826 / ISSN web 1662-9795)

  Papers will be sent for indexing by Scopus, Inspec, Chemical Abstracts Service, Google Scholar etc.

History: 
   ICMDA 2022: Vol. 931. Key Engineering Materials-ISBN: 978-3-0357-2847-7-Online Linkage | Indexed by Scopus
   ICMDA 2021: Vol. 324. Solid State Phenomena-ISBN: 978-3-0357-1859-1-Online Linkage | Indexed by Ei Compendex & Scopus
   ICMDA 2020: Vol. 1009, Materials Science Forum-ISBN: 978-3-0357-1688-7-Online Linkage | Indexed by Ei Compendex & Scopus
   ICMDA 2019: Vol. 972, Materials Science Forum-ISBN: 978-3-0357-1530-9-Online Linkage | Indexed by Ei Compendex & Scopus
   ICMDA 2018: Vol. 937, Materials Science Forum-ISBN: 978-3-0357-1377-0-Online Linkage | Indexed by Ei Compendex & Scopus

Submission Method: 
  System Submission: http://confsys.iconf.org/submission/icmda2024
  Email Submission: [email protected]
  For more details, you can learn through: http://www.icmda.org/sub.html

Call for Paper: 
  -Materials Properties, Measuring Methods and Applications
   Fracture Mechanics
   Mechanical Properties
   Electrical Properties

  -Materials Science and Materials Processing Technology
   Biological Material
   Chemical Materials
   Smart Materials and Intelligent Systems

  -Materials Analyses and Modeling
   Metallography
   Computational Material Science
   Numerical Techniques

  For more topics, please visit: http://www.icmda.org/cfp.html

Contact Us:
  Conference Secretary: Ms. Alyson Li
  Email: [email protected]
  Tel: +1-669-900-4528/+86-28-87577778
  Working Time: Monday - Friday; 9:30-18:00 (UTC/GMT+08:00)

Registration Fees
Available
Registration Fees Details
Registration Ways
Email
Website
Address/Venue
Tokyo Institute of Technology, Japan  Tokyo Institute of Technology, Japan 
Contact
Ms. Alyson Li

[email protected]