2023 The 6th International Conference on Smart Materials Applications (ICSMA 2023)

Co-organized by South Asia Institute of Science and Engineering (SAISE), Sichuan University, China, Yonsei University, South Korea and Tokyo University of Science, Japan

Conference Proceedings
  All submissions will be peer reviewed, the registered and presented papers will be published into Conference Proceedings, which is indexed by Scopus.

ICSMA Histories
  ICSMA2022 was held online during January 21-24, 2022
  ICSMA2021 was held online during January 12-14, 2021 
  ICSMA2020 was held at Yonsei University, Seoul, South Korea during January 13-16, 2020  
  ICSMA2019 was held at Tokyo University of Science, Tokyo, Japan during January 19-22, 2019  
  ICSMA2018 was held at National University of Singapore, Singapore during January 26-28, 2018 

Topics
  (Topics of interest for submission include, but are not limited to:)

  ~Materials Science and Engineering
    Metallic Alloys, Tool Materials, Superplastic Materials, 
    Ceramics and Glasses, Composites, Amorphous Materials,
    Nano-materials, Biomaterials, Multifunctional Materials, 
    Smart Materials, Engineering Polymers, Functional materials......
  
 ~Materials Properties, Measuring Methods and Applications
   Ductility, Crack Resistance, Fatigue, Creep-resistance, 
   Fracture Mechanics, Mechanical Properties, 
   Electrical Properties, and Magnetic Properties, 
   Corrosion, Erosion, Wear Resistance, 

 ~Methodology of Research and Analysis and Modeling
   Electron Microscopy, X-ray Phase Analysis, Metallographic, 
   Quantitative Metallographic, Image Analysis, 
   Computer Assistance in the Engineering Tasks and Scientific Research, 
   Numerical Techniques, Statistic Methods, Residual Life Analysis, 
   Process Systems Design, Mould Flow Analysis, Rapid Prototyping......

 ~Materials Manufacturing and Processing
   Casting, Powder Metallurgy, Welding, Sintering, 
   Heat Treatment, Thermo-Chemical Treatment, 
   Thin & Thick Coatings, Surface Treatment, 
   Machining, Plastic Forming, Quality Assessment, 
   Automation Engineering Processes, Robotics, 
   Mechatronics, Technological Devices and Equipment......

  (Looking for more topics, please visit at http://www.icsma.org/cfp.html)

Submission Information 
  Submissioon link: http://confsys.iconf.org/register/icsma2023
  Email:  [email protected]
  Paper template: http://www.icsma.org/TTP_template.doc
  Abstract Template: http://www.icsma.org/Abstract-Template.doc
  (Abstract means presentation only, only Full paper submission will be published in conference proceedings if accepted.)

Contact Us
  Conference Secretary: Ms. Saya Shen
  Email: [email protected]
  Tel: +852-30717761 (HK) / +86-18062000004 (China）