2023 2nd International Conference on Intelligent Systems Design and Engineering Applications (ISDEA 2023)

1 year ago Posted By : User Ref No: WURUR117179 0
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  • TypeConference
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  • Location Okayama, Japan
  • Price
  • Date 12-05-2023 - 14-05-2023
2023 2nd International Conference on Intelligent Systems Design and Engineering Applications (ISDEA 2023), Okayama, Japan
Conference Title
2023 2nd International Conference on Intelligent Systems Design and Engineering Applications (ISDEA 2023)
Event Type
Conference
Conference Date
12-05-2023 to 14-05-2023
Location
Okayama, Japan
Organization Name / Organize By
ISDEA 2023
Organizing/Related Departments
International Conference on Intelligent Systems Design and Engineering Applications
Organization Type
Academy
ConferenceCategory
Both (Technical & Non Technical)
ConferenceLevel
International
Related Industries

Computer Science

Information Technology

Computer/Technology

Location
Okayama, Japan

Publication:

All accepted papers in the regular oral presentation / poster will be published in ISDEA 2023 conference proceedings and included into Lecture Notes in Electrical Engineering-Springer book series after review, which is indexed by EI Compendex and Scopus databases.

Call for Papers:
Web intelligence
Search engines
Risk management
Artificial Neural Networks
Mathematical foundations of neural networks
Architectures and algorithms
Image, video and multidimensional signal processing
Derivatives pricing
Information retrieval (web mining)
Discovering patterns in continuous data
Uncertainty management for data mining
Clustering algorithms and applications
Adaptation and learning
Parallel database systems
Data and knowledge sharing
Automated software Testing and analysis
Knowledge-based software engineering
Cognitive networking
Knowledge based control systems
Adaptive control systems
More topics: http://www.isdea.org/cfp.html

Agenda Overview:
DAY 1 May 12, 2023
10:00 am--17:00 pm  Conference Sign in and Materials Collection

DAY 1 May 13, 2023
09:00 am--19:00 pm Keynote session+technical session

DAY 1 May 14, 2023
09:00 am--19:00 pm Keynote session+technical session

Venue:
Okayama University, Japan
Address: 1丁目-1-1 Tsushimanaka, Kita Ward, Okayama, 700-8530

Submission Methods:
Full Paper (publication and oral presentation)
Abstract (oral presentation only)
Electronic Submission System: http://confsys.iconf.org/submission/isdea2023
Or you could submit your paper by email directly via [email protected]

Contact:
Ms. Rachel Cao 
Email: [email protected]

Registration Fees
Available
Registration Fees Details
Registration Ways
Email
Website
Address/Venue
Okayama, Japan  Okayama, Japan 
Contact
Ms. Rachel Cao

[email protected]