2021 The 6th International Conference on Mechanical and Electronics Engineering (ICMEE 2021)

Accepted papers can be published in * ICMEE IOP proceedings * and indexed by *EI Compendex, Scopus*, etc

{ History }
The 1st ICMEE-Kyoto, Japan | IEEE Xplore ISBN: 978-1-4244-7480-6 
The 2nd ICMEE-Hefei, China | AMM ISBN: 978-3-03785-286-6 
The 3rd ICMEE-Tianjin, China | AMM ISBN: 978-3-03785-286-6 
The 4th ICMEE-Beijing, China | AMM ISBN: 978-3-03785-286-6 
The 5th ICMEE-Dalian, China | Matec ISSM: 2261-236X Vol.31 

{ Submission Method }
1. Send your manuscript directly to conference official email: [email protected] 
2. Submit your paper through easychair system: http://confsys.iconf.org/submission/icmee2021

{ Venue }
Osaka International Convention Center, Osaka, Japan
Add: 5-3-51, Nakanoshima Kita-ku, Osaka 530-0005 JAPAN

{ Contact }
Ms. Serene Lo
[email protected] 
+86-028-83208181