2021 The 6th International Conference on Integrated Circuits and Microsystems (ICICM 2021)

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  • TypeConference
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  • Location Nanjing, China
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  • Date 22-10-2021 - 24-10-2021
2021 The 6th International Conference on Integrated Circuits and Microsystems (ICICM 2021), Nanjing, China
Conference Title
2021 The 6th International Conference on Integrated Circuits and Microsystems (ICICM 2021)
Event Type
Conference
Conference Date
22-10-2021 to 24-10-2021
Location
Nanjing, China
Organization Name / Organize By
ICICM 2021
Organizing/Related Departments
International Conference on Integrated Circuits and Microsystems
Organization Type
Academy
ConferenceCategory
Both (Technical & Non Technical)
ConferenceLevel
International
Related Industries

Computer/Technology

Communications

Location
Nanjing, China

==Publication: Conference Proceeding
==Indexed by: Ei Compendex, and Scopus, etc.
==Submission email: [email protected] (Or you still can submit to the submission system https://easychair.org/conferences/?conf=icicm2021)
==Find the tempalte with the link: http://icicm.net/files/Template.doc


★Co-sponsored by★
University of Electronic Science and Technology of China, China
Technology of China and Southeast University, China


★ICICM Committees★
Advisory Chairs     
David Z. Pan, The University of Texas at Austin, United States (IEEE Fellow, SPIE Fellow)
Ljiljana Trajkovic, Simon Fraser University, Canada (IEEE Fellow)
      
Conference Chairs     
Zhigong Wang, Southeast University, China
Li Qiang, University of Electronic Science and Technology of China, China(Founding Chair of IEEE Chengdu SSCS/CASS Joint Chapter)
      
Program Chairs     
Fei Yuan, Ryerson University, Canada(Senior Member of IEEE and IET Fellow)
Zou Zhuo, Fudan University, China(Senior Member of IEEE)
Liu Dake, Beijing Institute of Technology, China | Linköping University, Sweden
      
Steering Committee Chair
Huang Le Tian, University of Electronic Science and Technology of China, China

Technical Committee
Zhenhai Chen, Hefei University of Technology, China
Junji Cheng, University of Electronic Science and Technology of China, China
Pan Dai, Huzhou University, China
Quanzhen Duan, Tianjin University of Technology, China
Hossein Fariborzi, King Abdullah University of Science and Technology, Saudi Arabia
Shengming Huang, Tianjin University of Technology, China
Sheng-Lyang Jang, National Taiwan University of Science and Technology, Taiwan
Xiangliang Jin, Hunan Normal University, China
Biba Josef, Universität der Bundeswehr München, Germany
Atsushi Kurokawa, Hirosaki University, Japan 
Wen Cheng Lai, National Taiwan University of Science and Technology, Taiwan
Qi Li, Guilin University of Electronic Technology, China
Weiguang Sheng, Shanghai Jiao Tong University, China
Chunyi Song, Zhejiang University, China 
Haizhi Song, University of Electronic Science and Technology of China, China
Jiajia Sun, China Academy of Space Technology, China
Lu Tang, Southeast University, China
Somboon Theerawisitpong, Rajamangala University of Technology Thanyaburi, Thailand
Wensi Wang, Beijing University of Technology, China
Weilin Xu, Guilin University of Electronic Technology, China
Jong-Ryul Yang, Yeungnam University, South Korea
Changchun Zhang, Nanjing University of Posts and Telecommunications, China 
For more members, please visite conference website: http://www.icicm.net/committee.html


★History★
<ICICM2020 | IEEE Publisher | Nanjing,China | October 23-25, 2020>
Papers of ICICM2020 can be checked in IEEE Xplore!
Electronic ISBN: 978-1-7281-8978-9 | USB ISBN: 978-1-7281-8977-2

<ICICM2019 | IEEE Publisher | Beijing, China | October 25-27, 2019>
Papers of ICICM2019 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus!
Electronic ISBN: 978-1-7281-5132-8 | USB ISBN: 978-1-7281-5131-1

<ICICM2018|IEEE Publisher|Shanghai,China|Nov.24-26, 2018>
Papers of ICICM2018 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus!
Electronic ISBN: 978-1-5386-8311-8 | USB ISBN: 978-1-5386-8310-1 | Print on Demand(PoD) ISBN: 978-1-5386-8312-5

<ICICM2017|IEEE Publisher|Nanjing,China|Nov.8-11,2017> 
Papers of ICICM2017 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus!
Electronic ISBN: 978-1-5386-3506-3 | Print ISBN: 978-1-5386-3505-6 | DVD ISBN: 978-1-5386-3504-9 | Print on Demand(PoD) ISBN: 978-1-5386-3507-0

<ICICM2016|IEEE Publisher|Chengdu,China|Nov.23-25, 2016 >
Papers of ICICM2016 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus!
Electronic ISBN: 978-1-5090-2814-6 | Print ISBN: 978-1-5090-2813-9 | Print on Demand(PoD) ISBN: 978-1-5090-2815-3


★Topics★
Digital, Analog, Mixed Signal IC and SOC design technology
Silicon integrated circuits and manufacturing
Low-power, RF devices & circuits
IC Computer-Aided –Design technology, DFM
Silicon/germanium devices and device physics
Interconnect, Low K, High K and other process technologies
Unconventional and nano-electronics
Organic semiconductor devices and technologies
Compound semiconductor devices and circuits
Displays, sensors and MEMS
Semiconductor materials and material characterization
Packaging and testing technology
Solar cell & other devices for new energy sources
Modeling and simulation
Equipment technology
Reliability
Displays, sensors and MEMS
Advance memories technology (Flash, FeRAM, PCM,ReRAM, MRAM etc.)

★Conference Contact★
Ms Zeng
Email: [email protected]
Tel: +86-28-87777577
Web: www.icicm.net

Registration Fees
Available
Registration Fees Details
Registration Ways
Email
Website
Address/Venue
  Nanjing,China 
Contact
Ms Zeng

[email protected]

   +86-28-87777577