2020 The 5th International Conference on Integrated Circuits and Microsystems (ICICM 2020)

Publication: All accepted papers after proper presentation and registration will be collected in the IEEE conference proceedings, which will be submitted and reviewed in the IEEE Xplore, Ei Compendex, Scopus, and CPCI (Web of Science) after the conference.
==Submission email:[email protected] (Or you still can submit to the submission system on website)
==Find the tempalte with the link: http://icicm.net/Template.doc (Word)  http://icicm.net/WIN-or-MAC-LaTeX2e-Transactions-Style-File.zip (Latex)

★Keynote Speakers
Prof. Ljiljana Trajkovic, IEEE Fellow,Simon Fraser University, Canada
Prof. Fei Yuan，Ryerson University, Canada

★Invited Speakers
Prof. Sheng-Lyang Jang,National Taiwan University of Science and Technology, Taiwan
Prof. Dai Yong-Sheng,Nanjing University of science & Technology, China

★ICICM Committees
Advisory Chair
Prof. Ljiljana Trajkovic, IEEE Fellow,  Simon Fraser University, Canada

Conference Chairs
Prof. Zhigong Wang, Southeast University, China
Prof. Li Qiang, University of Electronic Science and Technology of China, China
Prof. Gene Eu Jan, National Taipei University, Taiwan

Program Chairs
Prof. Fei Yuan, Ryerson University, Canada
Prof. Zou Zhuo, Fudan University, China
Prof. Liu Dake, Beijing Institute of Technology, China | Link?ping University, Sweden 
Assoc. Prof. Keping Wang, Southeast University, China

Steering Committee Chairs
Prof. Huang Le Tian, University of Electronic Science and Technology of China, China
Prof. Dai Yong-Sheng, Nanjing University of Science & Technology, China 
Prof. Sheng-Lyang Jang, National Taiwan University of Science and Technology, Taiwan

Technical Committee
Prof. Xiaoxiao Wang, BeiHang University, China
Prof. Bo Yan, University of Electronic Science & Technology of China, China
Prof. Dr. Ashutosh Kumar Singh, National Institute of Technology, Kurukshetra, India
Assis. Prof. Hossein Fariborzi, King Abdullah University of Science and Technology, Saudi Arabia
Assoc. Prof. Hamed Alipour-Banaei, Islamic Azad University, Iran
Assoc. Prof. Tiejun Chen, Yiyang Medical College, China
Assis. Prof. Weiguang Sheng, Shanghai Jiao Tong University, China
Prof. Changchun Zhang, Shanghai University of Posts and Telecommunication / Southeast University, China
Assis. Prof. Yu Bai, California State University Fullerton, USA
Prof. Jinzhao Wu, Guangxi University for Nationalities, China
Prof. Shiwei Feng, Beijing University of Technology, China
Assoc. Prof. Wei Ni, Hefei University of Technology, China
Prof. Xingyuan Tong, Xi'an University of Posts & Telecommunications,China
Prof. Jinyan Wang, Peking University, China
Prof. Zhi-Jian Xie, NC A&T State University, USA
Prof. S. Ushakumari, College of Engineering Trivandrum, India
Prof. Lu Tang, Southeast University, China
Prof. Haizhi Song, University of Electronic Science and Technology of China, China
Prof. Tang Bin, Chengdu Aeronautic Polytechnic, The Innovation Base of School-Enterprise Cooperation Aviation Electronic Technology in Sichuan, China
Prof. Shiwei Feng, Beijing University of Technology,China
Assoc.Prof. Quanzhen Duan,Tianjin University of Technology, China
Assoc.Prof. Yue Ming Ding,Tianjin University of Technology,China
Prof.Shengming Huang,Tianjin University of Technology, China
Prof. Fei Yuan, Ryerson University, Canada
Assoc. Prof. Guolin Sun, Beihang University, China
Assoc. Prof. Yuan-Hao Huang, National Tsing Hua University,Taiwan
Asst. Prof. Dr. Najam Muhammad Amin, Bahria University, Pakistan
Prof. Dr.Qifeng Xu, Fuzhou University, China

For more members, please visit conference website: http://www.icicm.net/committee.html

★History
<ICIC2019|IEEE Publisher|Beijing,China|October 25-27, 2019>
Papers of ICICM2019 can be checked in IEEE Xplore!
Electronic ISBN: 978-1-7281-5132-8 | USB ISBN: 978-1-7281-5131-1

<ICIC2018|IEEE Publisher|Shanghai,China|Nov.24-26, 2018>
Papers of ICICM2018 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus!
Electronic ISBN: 978-1-5386-8311-8 | USB ISBN: 978-1-5386-8310-1 | Print on Demand(PoD) ISBN: 978-1-5386-8312-5

<ICICM2017|IEEE Publisher|Nanjing,China|Nov.8-11,2017> 
Papers of ICICM2017 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus!
Electronic ISBN: 978-1-5386-3506-3 | Print ISBN: 978-1-5386-3505-6 | DVD ISBN: 978-1-5386-3504-9 | Print on Demand(PoD) ISBN: 978-1-5386-3507-0

<ICICM2016|IEEE Publisher|Chengdu,China|Nov.23-25, 2016 >
Papers of ICICM2016 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus!
Electronic ISBN: 978-1-5090-2814-6 | Print ISBN: 978-1-5090-2813-9 | Print on Demand(PoD) ISBN: 978-1-5090-2815-3

★Topics
Digital, Analog, Mixed Signal IC and SOC design technology
Silicon integrated circuits and manufacturing
Low-power, RF devices & circuits
IC Computer-Aided –Design technology, DFM
Silicon/germanium devices and device physics
Interconnect, Low K, High K and other process technologies
Unconventional and nano-electronics
Organic semiconductor devices and technologies
Compound semiconductor devices and circuits
Displays, sensors and MEMS
Semiconductor materials and material characterization
Packaging and testing technology
Solar cell & other devices for new energy sources
Modeling and simulation
Equipment technology
Reliability
Displays, sensors and MEMS
Advance memories technology (Flash, FeRAM, PCM，ReRAM, MRAM etc.)

★Support
1, Technical Support from IEEE
2, Sponsored by University of Electronic Science and Technology of China and Southeast University, China

★Conference Schedule
1) October 23, 2020—Registration & Material Collecting 
2) October 24, 2020—Keynote & Invited Speeches & Papers Presentations
3) October 25, 2020—Papers Presentations

★Conference Contact
Ms Daisy Tseng
Email: [email protected]
Tel: +86-28-87777577