2019 4th International Conference on Functional Materials and Steel (ICFMS 2019)

5 years ago Posted By : User Ref No: WURUR26575 0
  • Image
  • TypeConference
  • Image
  • Location Tokyo, Kanto, Japan
  • Price
  • Date 06-09-2019 - 08-09-2019
2019 4th International Conference on Functional Materials and Steel (ICFMS 2019), Tokyo, Kanto, Japan
Conference Title
2019 4th International Conference on Functional Materials and Steel (ICFMS 2019)
Event Type
Conference
Conference Date
06-09-2019 to 08-09-2019
Location
Tokyo, Kanto, Japan
Organization Name / Organize By
ICFMS 2019
Organizing/Related Departments
International Conference on Functional Materials and Steel
Organization Type
Academy
ConferenceCategory
Both (Technical & Non Technical)
ConferenceLevel
International
Related Industries

Engineering

Architecture/Interior Designing

Manufacturing

Location
Tokyo, Kanto, Japan

Publication:
All submitted conference papers will be peer-reviewed by 2-3 competent reviewers. After a careful reviewing process, all accepted papers after proper registration and presentation, will be published in the ICEIM 2019 conference proceedings as a special chapter, which will be indexed by Ei Compendex and Scopus.

Agenda Overview:
September 6: Conference Check in and Materials Collection
September 7: Opening Remarks, Keynote Speech and Parallel Sessions
September 8: Parallel Sessions and Academic Visiting (pending)

Submission Methods:
1. Full Paper(publication and oral presentation)
2. Abstract(oral presentation only)
Please submit your paper or abstract via Electronic Submission System (http://confsys.iconf.org/submission/icfms2019
) or email ([email protected])

Conference Venue: Senjyu Campus, Tokyo Denki University, Japan
Address: 5 Senju Asahi-cho, Adachi-ku, Tokyo, Japan, Zip code: 120-8551


Contacts:
Mr. Jack T. Feng
E-mail: [email protected]
Tel: +86-18381008370

Registration Fees
Available
Registration Fees Details
Registration Ways
Email
Website
Address/Venue
  Senjyu Campus, Tokyo Denki University, Japan 
Contact
Mr. Jack T. Feng

[email protected]

   +86-18381008370