- TypeConference
- Location Tokyo, Tohoku, Japan
- Date 03-09-2017 - 05-09-2017
Engineering
Electrical/Electronics
Biotechnology
Manufacturing
2017 6th International Conference on Engineering and Innovative Materials (ICEIM 2017) will be held in Setagaya Campus, Kokushikan University,Tokyo, Japan during September 3-5, 2017. This conference provides opportunities for the different areas delegates to exchange new ideas and application experiences face to face, to establish business or research relations and to find global partners for future collaboration. We hope that the conference results constituted significant contribution to the knowledge in these up to date scientific field.
The organizing committee of conference is pleased to invite prospective authors to submit their original manuscripts to ICEIM 2017. To make the conference colorful, the conference committee will arrange the tour and academic visiting during the conference.
PUBLICATION:
All submissions will be peer reviewed by 2-3 reviewers. All the registered and presented papers will be published in volume of Materials Science Forum (ISSN:1662-9752), which indexed by Elsevier: SCOPUS, Ei Compendex (CPX), Index Copernicus Journals Master List, Google Scholar, etc.
HISTORY:
ICEIM 2015 and ICEIM 2016 were successfully held in Penang and Kuala Lumpur, Malaysia. The ICEIM 2014 and ICEIM 2015 have been indexed by Ei compendex.
SUBMISSION METHODS:
Full Paper(publication and oral presentation)
Abstract(oral presentation only)
Electronic Submission System (.pdf)
http://www.easychair.org/conferences/?conf=iceim2017
For more details and updates please visit website