2019 International Conference on Intelligent Chip Design and Semiconductor Circuit(ICDSC 2019)

6 years ago Posted By : User Ref No: WURUR24229 0
  • Image
  • TypeConference
  • Image
  • Location Sanya, Hainan, China
  • Price
  • Date 05-01-2019 - 07-01-2019
2019 International Conference on Intelligent Chip Design and Semiconductor Circuit(ICDSC 2019), Sanya, Hainan, China
Conference Title
2019 International Conference on Intelligent Chip Design and Semiconductor Circuit(ICDSC 2019)
Event Type
Conference
Conference Date
05-01-2019 to 07-01-2019
Last Date for Applying
05-12-2018
Location
Sanya, Hainan, China
Organization Name / Organize By
Engineering Information Institute
Organizing/Related Departments
Engineering Information Institute
Organization Type
Academy
ConferenceCategory
Technical
ConferenceLevel
International
Related Industries

Information Technology

Location
Sanya, Hainan, China

ICDSC 2019 is sponsored by Engineering Information Institute, Open Access Library, Scientific Research Publishing, and 1000thinktank. 

 

Call for Papers

AI ChipDesign
Analog and mixed-signal circuits 
Analog signal processing
Chip-to-chip communications
Circuit technologies 
Circuits/devices modeling, verification and testing 
Data converters and Data storage
Digital architectures and systems
Digital integrated circuits
Digital/synthesizable voltage regulators and plls
Emerging ic and system 
Energy harvesting circuits and systems
Hardware-security circuits
High-bandwidth i/o interfaces
Image sensors and companion chips
Intra-chip communication circuits
Intelligent Chip
Memory design and Memory/ssd controllers
Memory-subsystem enhancements
Mems-based integrated systems
Micro-controllers and Microprocessors
Nano electronics circuits
Power control and management 
Processing-in-memory
Processors/ multiprocessors 
Reconfigurable architectures & FPGA-based designs
RF integrated circuits and microwave engineering 
Sensor interface circuits
Special-purpose digital circuits
Subthreshold and near-threshold circuits
Switched-mode power supplies
System-level power management
Ultrasonic sensors, neural interfaces and closed-loop systems
Wide-bandgap-semiconductor
Wireless sensing, radar and localization

Registration Fees
Available
Registration Fees Details
Package A: Regular Attendance (No Submission Required) USD 400(RMB 2400) Package B: Regular Attendance+Abstract+Presentation USD 450(RMB 2700) Package C: Regular Attendance+Paper Publication+Presentation USD 650(RMB 3600)
Registration Ways
Website
Address/Venue
  International Asia-Pacific Convention Center Sanya 
Official Email ID
Contact
Ms. Vivian

[email protected]

   +86 132 6470 2250