IEEE--2018 The 3rd International Conference on Integrated Circuits and Microsystems (ICICM 2018)

IEEE--2018 The 3rd International Conference on Integrated Circuits and Microsystems (ICICM 2018)--Ei Compendex and Scopus

★IEEE ICICM2018--IEEE Xplore, Ei Compendex, and Scopus★

2018 The 3rd International Conference on Integrated Circuits and Microsystems
Time:  November 24-26, 2018
Place: Shanghai,China
http://www.icicm.net/

(For early submission, it will get the feedback within 1month)
==Publication: IEEE Conference Proceeding
==Indexed by: IEEE Xplore, Ei Compendex, and Scopus*
==Submission email:[email protected] (Or you still can submit to the submission system on website)
==Find the tempalte with the link:http://www.icicm.net/Template.doc

★Keynote Speakers & Invited Speakers:
Prof. Degang James Chen, IEEE Fellow, Iowa State University, USA;
Prof. Gene Eu (Ching Yuh) Jan,National Taipei University, Taiwan;
Prof. Fei Yuan,Ryerson University,Canada;
Prof. Zhi-Jian Xie,North Carolina A&T State University, USA.

★Advisory Chairs:
Prof. Degang James Chen, IEEE Fellow, Iowa State University, USA;
Prof. Meng-Fan (Marvin) CHANG, National Tsing Hua University (NTHU), Taiwan.

★Conference Chairs:
Prof. Zhigong Wang, Southeast University, China;
Prof. Li Qiang, University of Electronic Science and Technology of China, China.

★Conference Co-Chair:
Prof. Gene Eu Jan, National Taipei University, Taiwan.

★Program Chairs:
Prof. Fei Yuan, Ryerson University, Canada;
Prof. Zhi-Jian Xie, North Carolina A&T State University, USA.

★Steering Committee Chair:
Prof. Huang Le Tian, University of Electronic Science and Technology of China, China.

★Technical Committee:
Prof. Bo Yan, University of Electronic Science & Technology of China, China;
Prof. Dr. Ashutosh Kumar Singh, National Institute of Technology, Kurukshetra, India;
Prof. Xiaoxiao Wang, BeiHang University, China;
Prof. Changchun Zhang, Shanghai University of Posts and Telecommunication / Southeast University, China;
Prof. Jinzhao Wu, Guangxi University for Nationalities, China;
Prof. Shiwei Feng, Beijing University of Technology, China;
Assoc. Prof. Wei Ni, Hefei University of Technology, China;
Assoc. Prof. Xingyuan Tong, Xi'an University of Posts & Telecommunications, China;
Assis. Prof. Li Jiang, Shanghai Jiao Tong University, China;
Prof. Jinyan Wang, Peking University, China;
Prof. Zhi-Jian Xie, NC A&T State University, USA;
Prof. S. Ushakumari, College of Engineering Trivandrum, India;
Prof. Lu Tang, Southeast University, China;
Prof. Haizhi Song, University of Electronic Science and Technology of China, China;
Prof. Tang Bin, Chengdu Aeronautic Polytechnic, The Innovation Base of School-Enterprise Cooperation Aviation Electronic Technology in Sichuan, China;
Prof. Shiwei Feng, Beijing University of Technology,China;
For more members, please visite conference website: http://www.icicm.net/committee.html

★★History:
<ICICM2016|IEEE Publisher|Chengdu,China|Nov.23-25, 2016 >
Papers of ICICM2016 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus!
Electronic ISBN: 978-1-5090-2814-6 | Print ISBN: 978-1-5090-2813-9 | Print on Demand(PoD) ISBN: 978-1-5090-2815-3

<ICICM2017|IEEE Publisher|Nanjing,China|Nov.8-11,2017> 
Papers of ICICM2017 can be checked in IEEE Xplore now!
Electronic ISBN: 978-1-5386-3506-3 | Print ISBN: 978-1-5386-3505-6 | DVD ISBN: 978-1-5386-3504-9 | Print on Demand(PoD) ISBN: 978-1-5386-3507-0

<ICIC2018|IEEE Publisher|Shanghai,China|Nov.24-26, 2018>

★TOPICS:
Digital, Analog, Mixed Signal IC and SOC design technology
Silicon integrated circuits and manufacturing
Low-power, RF devices & circuits
IC Computer-Aided –Design technology, DFM
Silicon/germanium devices and device physics
Interconnect, Low K, High K and other process technologies
Unconventional and nano-electronics
Organic semiconductor devices and technologies
Compound semiconductor devices and circuits
Displays, sensors and MEMS
Semiconductor materials and material characterization
Packaging and testing technology
Solar cell & other devices for new energy sources
Modeling and simulation
Equipment technology
Reliability
Displays, sensors and MEMS
Advance memories technology (Flash, FeRAM, PCM，ReRAM, MRAM etc.)

★Support:
1, Technical Support from IEEE
2, support from University of Electronic Science and Technology of China and Southeast University, China

★Conference schedule:
1) Nov. 24, 2018—Conference Materials Collection 
2) Nov. 25, 2018—Keynote Speeches & papers Presentations
3) Nov. 26, 2018—Peer-Reviewed Presentations

★Conference Contact:
Ms Sissi Chan
Email: [email protected]
Tel: +86-28-87777577