IC Packaging Fair

ICPF gathers domestic packaging and testing (P&T) factories, IDM brands with packaging and testing processes, and leading electronic manufacturing service buyers, with buyers' P&T products covering a full range of categories, including semiconductor integrated circuits, optoelectronic devices, power devices, and sensors. It comprehensively showcases advanced solutions for semiconductor packaging and testing throughout the entire process, including equipment and materials, to help exhibitors discover and develop new customers, expand into new tracks, and promote business cooperation between upstream and downstream in the packaging and testing segment, ultimately enhancing the overall manufacturing strength of the domestic semiconductor packaging and testing industry.

For more information, visit https://www.nepconasia.com/en-gb/bandaoti/ic-pack.html

For exhibition inquiries, please contact Julia Gu at [email protected] (+86 21 2231 7010) or Bruce Xu at [email protected] (+86 21 2231 7051)

For marketing collaboration, please contact Caroline Ye at [email protected] (+86-755-2383 4568)

For visiting inquiries, please contact Walden Li at [email protected] (+86 136-5125-1335)