2018 The 7th International Conference on Manufacturing Engineering and Process (ICMEP 2018) is a platform for researchers, engineers, academicians as well as industrial professionals from all over the world to present their research results and development activities in Manufacturing Engineering and Process.This conference provides opportunities for the delegates to exchange new ideas and application experiences face to face, to establish business or research relations and to find global partners for future collaboration.
It will take place Barcelona, Spain, February 5-7, 2018. We will be thankful for the contributions to ICMEP 2018. We look forward to your participation and continued engagement.
1. Submit your paper through easychair system.
2. Send your manuscript directly to conference official email: firstname.lastname@example.org
Call for Papers:
Conference Scope and Topics are followings (but are not limitted to)
Papers submitted via the Electronic Submission System / email@example.com, will be peer reviewed, and accepted and registered full papers will be published into
IOP Conference Series: Journal of Physics
(Print ISSN: 1742-6588|Online ISSN: 1742-6596|doi:10.1088/issn.1742-6596)
which is indexed by EI Compendex, Scopus, Thomson Reuters (WoS), Inspec,et al.
Publication and Previous ICMDE Conferences: http://www.icmep.org/history.html
ICMEP 2017, May 27-29, Lisbon, Portugal
Proceedings will online soon…
ICMEP 2016, May 25-27, Istanbul, Turkey
Proceedings online (EI Index, SCOPUS Index): https://www.scientific.net/MSF.887.32
ICMEP 2015, April 13-14, Paris, France
Proceedings online (EI Index, SCOPUS Index): http://www.ttp.net/978-3-03785-707-6.html/
ICMEP 2014, April 10-11, Seoul, Korea
Proceedings online (EI Index, SCOPUS Index): http://www.ttp.net/978-3-03835-084-2.html/
ICMEP 2013, April 13-14, Vancouver, Canada
Proceedings online (EI Index): http://www.ttp.net/978-3-03785-707-6.html/
ICMEP 2012, April 21-22, Kunming, China
Proceedings online (EI Index): http://www.ttp.net/978-3-03785-405-1.html
International Advisory Committee
Joao Seixas, University Lisbon, Portugal
Mário S. Ming Kong, University Lisbon, Portugal;
Osman Adiguzel, Firat University, Turkey.
Andrea Deaconescu, Transilvania University of Brasov, Romania;
Ilhan Asiltürk, Selcuk University, Turkey;
Serhat Ikizoglu, Istanbul Technical University, Turkey.
Joerg Niemann,University of Applied Sciences Düsseldorf, Germany;
Cherkaoui Abdelghani,Mohamed V University, Morocco;
Porojan Liliana, “V. Babes” University of Medicine and Pharmacy, Romania;
Hatice S. Sas, Abdullah Gul University, Turkey ;
Francisco Klebson Gomes dos Santos, Universidade Federal Rural do Semi Arido, Brazil;
Mohammed Sriti, Sidi Mohamed Ben Abdellah University, Morocco;
Gastao Coelho de Aquino Filho, Science and Technology of Paraíba IFPB-Campus Cajazeiras, Brazil;
Thien-My Dao, University of Québec Montreal, Canada;
José B.Aguiar, University of Minho, Portugal;
Halit S. Turkmen, Istanbul Technical University, Turkey;
Balan George, University of Sibiu, Romania;
Yahya Bozkurt, Marmara University, Turkey;
Vladimir Strezov, Macquarie University, Australia;
Sureerat Polsilapa, Kasetsart University, Thailand;
Moraru Roland, University of Petrosani, Romania;
Muhammad Fahad, Neduet Karachi Pakistan, Pakistan;
Che Hassan Bin Che Haron, National University of Malaysia,Malaysia;
Jaharah Binti A. Ghani, National University of Malaysia, Malaysia;
Balhassn S. M. Ali, Bursa Orhangazi University, Turkey;
Hassan El-Hofy, Alexandria University, Egypt ;
Yusri Yusof, Universiti Tun Hussein Onn Malaysia, Malaysia;
Mehmet Karakose, Firat University,Turkey;
Hasan AL Dabbas, Philadelphia University, Jordan;
Supakorn Pukird, Ubon Ratchathani University, Thailand;
Mehmet Savsar, Kuwait University, Kuwait.
Prof. Jo?o Seixas, Superior Technical Institute of Lisbon (IST/UL), University Lisbon, Portugal;
Prof. Susana Cardoso Freitas, INESC Microsistemas e Nanotecnologias,Portugal;
Prof. Osman Adiguzel, FIRAT UNIVERSITY, TURKEY;
Prof. Mário S. Ming Kong, University Lisbon, Portugal.
For more details and updates please visit website.