2018 International Conference on Smart Materials Analysis (ICSMA 2018) will take place in Singapore during January 26-28, 2018. The conference program covered invited, oral, and poster presentations from scientists working in similar areas to establish platforms for collaborative research projects in this field. This conference will bring together leaders from industry and academia to exchange and share their experiences, present research results, explore collaborations and to spark new ideas, with the aim of developing new projects and exploiting new technology in this field.
ICSMA provides a forum for accessing to the most up-to-date and authoritative knowledge from both industrial and academic worlds, sharing best practice in the field of smart materials Analysis. The meeting will provide an opportunity to highlight recent developments and to identify emerging and future areas of growth in this exciting field.
Accepted and registered papers will be published into
IOP Conference Series: Materials Science and Engineering
(Online ISSN: 1757-899X; Print ISSN: 1757-8981)
Indexed by: EI Compendex, Scopus,Thomson Reuters (WoS), Inspec,et al
Please submit your full paper to us: email@example.com
Ms. Connie Young
Tel: +1-302-444-8432 (USA)/ +86-18062000004 (China)
For more details and updates please visit website.