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18th International Conference and Exhibition on Materials Science and Engineering in Osaka, Japan on May 2018 by Conference Series LLC

Conference Information


18th International Conference and Exhibition on Materials Science and Engineering


18th International Conference and Exhibition on Materials Science and Engineering, Osaka, Japan
Conference Title
18th International Conference and Exhibition on Materials Science and Engineering
Event Type
Conference
Conference Date
28-05-2018 to 30-05-2018
Last Date for Applying
29-04-2018
Location
Osaka, Japan

Publish / Maintain / Marketing / Hosted By
Organization Name / Organize By
Conference Series LLC
Organizing/Related Departments
Materials Science and Engineering
Organization Type
Event Organizing Company
Conference Category
Both (Technical & Non Technical)
Conference Level
International
Related Industries

Engineering

Location
Osaka, Japan

Conference Series LLC launches its Materials Science conference in Asia Pacific region. With the overwhelming joy, we invite you to the 18th International Conference and Exhibition on Materials Science and Engineering in Osaka, Japan during May 28-30, 2018

Theme of the conference, “Quarrying Novelties in Materials Science and Engineering” is designed in such a way to uncover the basic principles that lead to the drastic emergence and technologies in the field of Materials Science and Nanotechnology. We hope MatScience 2018 is the best platform to discuss the basic principles involved in the development of Materials Science and Engineering. As this conference deals with the basics concepts, students, delegates, academicians and business people can attend the conference to root up the knowledge and excel in this field.

Others Details

For more details and updates please visit website.

Registration Fees
Available
Registration Fees Details
$799
Registration Ways
Website
Address/Venue
Hyatt Regency, 1-13-11 Nanko-Kita, Suminoe-Ku, Osaka, Japan.  Pin/Zip Code : 559-0034
Official Email ID
matscience@materialsconferences.org
Contact
Allister Phan

2360 Corporate Circle, Suite 400 Henderson | NV 89074-7722, USA

matscience@materialsconferences.org

     16508896093