IEEE--2017 the 2nd International Conference on Integrated Circuits and Microsystems (ICICM 2017)

ICICM-International Conference on Integrated Circuits and Microsystems

is an annual conference, which aims to provide a platform for researchers, engineers, academicians as well as industrial professionals from all over the world to present their research results and development activities in Integrated Circuits and Microsystems. This conference provides opportunities for the delegates to exchange new ideas and research findings face to face, to establish business or research relations and to find global partners for future collaboration.
The first edition ICICM was sponsored by IEEE and it has been successfully held in Chengdu on November 23-25, 2016. The second International Conference on Integrated Circuits and Microsystems (ICICM 2017) will be held on November 8-11, 2017 in Nanjing, China (the capital city of six dynasties in ancient Chinese history) with the support from University of Electronic Science and Technology of China and Southeast University, China.

Proceedings

All accepted papers after proper presentation and registration will be collected in the conference proceedings, which will be submitted and reviewed in the IEEE Xplore, Ei Compendex, and Scopus after the conference.

==Conference schedule==
1) November 8, 2017—Conference Materials Collection
2) November 9, 2017—Keynote Speeches & Oral Presentations
3) November 10, 2017—Invited Speeches and author's Oral Presentations
4)  November 11, 2017—one day excursion in Nanjing

==Keynote Speaker==
Prof. Qiang Li,
University of Electronic Science and Technology of China,China;
More speakers to be added soon

==Sponsor==
IEEE(Institute of Electrical and Electronics Engineers)

==Co-Sponsored By==
Southeast University,China and University of Electronic Science and Technology of China,China

==Media Partner==
Science meeting online(http://www.meeting.edu.cn/meeting/),ChinaAET(http://www.chinaaet.com/), etc

Others Details

For more details and updates please visit conference website